The Applied Technical Services Family of Companies (ATS FoC) offers semiconductor defect analysis to help manufacturers identify material imperfections, resolve production issues, and assess component reliability. We examine semiconductor materials and devices for flaws affecting electrical performance, structural integrity, or operational life. Defects may arise during material production, wafer fabrication, component assembly, or handling. Our laboratory uses specialized inspection and analytical techniques to evaluate semiconductor features, characterize irregularities, and support quality assurance and failure investigations.
What Techniques Do We Use for Semiconductor Defect Analysis?
We use microscopic examination and material characterization to investigate suspected defects and assess component construction. The technique depends on the material, component geometry, defect location, and investigation objectives. Our analytical approach may include:
- Optical microscopy: Examines surface conditions, visible imperfections, and structural features.
- Scanning electron microscopy (SEM): Provides high magnification for examining fine surface details, contamination, cracks, and other microscopic irregularities.
- X-ray inspection and computed tomography (CT): Evaluate internal structures and identify potential defects without sectioning the component.
- Microsection analysis: Exposes internal structures for detailed examination of layers, interfaces, and interconnections.
Our team selects methods based on the suspected failure mechanism and the information available from the sample.
About Our Microsection Analysis Services
Our microsection analysis offers detailed examinations of semiconductor packages, electronic assemblies, and printed circuit boards. Technicians prepare samples by controlled sectioning, mounting, grinding, and polishing to expose specific internal features while preserving structural evidence. Microscopic examination then characterizes material interfaces, conductive pathways, solder joints, and layered structures.
Our evaluations address characteristics such as:
- Layer thickness, plating quality, and dimensional consistency.
- Cracks, voids, delamination, and incomplete bonding.
- Solder joint integrity and interconnection irregularities.
- Material separation and other manufacturing inconsistencies.
These examinations help manufacturers investigate suspected defects, compare component construction with design specifications, and evaluate potential production issues. Microsection analysis also provides physical evidence to support other inspection results during failure investigations.
How Does Semiconductor Defect Analysis Identify Root Causes of Failure?
Defect analysis links observed component problems to physical evidence explaining their origins. Engineers examine defect location, morphology, distribution, and relationships to surrounding materials to evaluate potential failure mechanisms. For example, cracks may indicate structural damage, while delamination may suggest interface integrity issues. Irregular plating or damaged interconnections can also affect electrical performance. By correlating microscopic findings with manufacturing history, operating conditions, and test results, investigators can narrow potential causes and recommend further evaluation. These findings support corrective actions, process improvements, and efforts to reduce recurring defects.
Request a Quote
Call +1 (888) 287-5227 or submit our online request form to connect with our team and learn how our laboratory services can support your semiconductor quality control, manufacturing investigations, and component reliability assessments.
