The Applied Technical Services Family of Companies (ATS FoC) provides semiconductor delamination testing to evaluate adhesion between bonded materials within semiconductor packages. Our testing identifies delamination at critical interfaces, including the die-to-mold compound interface, substrate layers, and lead frame, where separation can compromise package integrity and device reliability. We assess internal defects, characterize delamination locations, and evaluate their potential impact on semiconductor performance. Our services help semiconductor manufacturers, fabless companies, and assembly houses detect packaging defects, investigate manufacturing issues, and verify package quality before these defects lead to component failure.
Why Does Delamination Cause Semiconductor Device Failures?
Delamination weakens the bonds that protect your device, and gaps allow moisture and contaminants to reach the die, causing metal corrosion. Even microscopic gaps can expand under thermal cycling and mechanical stress. Separation may stretch or break bond wires and weaken solder joints. Trapped gaps impede heat flow, creating hot spots and shortening device lifespan. Common failure outcomes include:
- Open circuits and intermittent faults
- Corrosion and electrical leakage
- Popcorn cracking during reflow
- Early field returns
- Reduced reliability in harsh environments
Our Semiconductor Delamination Testing Services
We use proven inspection methods and deliver prompt, clear reports. Each test plan is tailored to your package type, including BGAs, QFNs, and power modules. Our services include:
- C-mode scanning acoustic microscopy (SAM)
- Cross-section analysis and failure analysis
- Pre- and post-stress comparisons
- Detailed reports with annotated images
- Rapid turnaround with expedited options
Each report details defect location, size, and severity, enabling your team to respond promptly. We deliver results quickly and explain all findings clearly.
How Does Moisture Sensitivity Level (MSL) Testing Relate to Delamination?
MSL testing measures a package’s resistance to moisture absorption before reflow soldering. Industry standards define levels from MSL 1 to MSL 6, each specifying floor life outside dry packaging. We bake, soak, and reflow your devices according to IPC/JEDEC J-STD-020, then scan for new delamination. Moisture absorbed during reflow turns to steam and may separate weak interfaces. A passing MSL rating confirms your package can withstand assembly without delaminating. We recommend scanning before and after testing to identify all changes. This approach provides objective evidence for customer qualification reports.
Contact Us
Complete our web request form or call +1 (888) 287-5227 to learn more about our delamination testing or other semiconductor services.
