The Applied Technical Services Family of Companies (ATS FoC) provides semiconductor CT and X-ray inspection services to evaluate internal component structures without damaging samples. Our highly trained technicians use 2D X-ray imaging for rapid screening and 3D computed tomography (CT) for detailed volumetric analysis. We deliver high-resolution images, precise measurements, and actionable findings to help manufacturers identify defects, maintain yields, and improve component reliability.
What Defects Can Semiconductor CT and X-ray Inspection Detect?
Non-destructive X-ray inspection detects internal defects that visual inspection can’t reveal. Our technicians assess semiconductor packages for solder voids, bridging, open connections, and head-in-pillow defects in ball grid array (BGA), land grid array (LGA), and quad flat no-lead (QFN) packages. We also evaluate:
- Broken or sagging wire bonds
- Die attach voids and substrate cracks
- Via plating defects and foreign material within encapsulants
Since these methods preserve sample integrity, manufacturers can continue electrical testing or return acceptable components to production.
About Our Semiconductor CT and X-ray Inspection Services
We select inspection methods based on component design, defect characteristics, and project objectives. Our capabilities include:
- 2D X-ray inspection: Screens solder joints, wire bonds, die attach materials, and other internal features.
- 3D CT scanning: Reconstructs internal structures for volumetric analysis of flip chip, 2.5D, and 3D semiconductor packages.
Our technicians quantify void percentages, measure internal features, and examine components for potential counterfeit indicators. Depending on project requirements, our analysis may include:
- Void dimensions, percentages, and locations
- Internal feature measurements and structural anomalies
- Differences between suspect and known-good components
Inspection reports include annotated images, measurement data, and clear summaries to help engineering and quality teams evaluate findings and determine next steps.
How Does Semiconductor CT Inspection Identify Voids, Cracks, and Bonding Defects?
Computed tomography reconstructs multiple X-ray projections into a 3D model, letting analysts examine internal features from multiple angles and isolate defects that may overlap in 2D images. Our engineers measure void dimensions and locations within solder joints, trace cracks through substrates and bumps, and evaluate wire bonds for breaks or separation. This detailed analysis helps manufacturers:
- Characterize internal anomalies and potential reliability concerns
- Evaluate component construction and assembly quality
- Determine whether components meet applicable quality requirements
How Does Semiconductor X-ray Inspection Support Failure Analysis?
X-ray inspection identifies potential defect locations before destructive procedures such as decapsulation or microsectioning. Our engineers use these findings to focus further analysis, preserve evidence, and reduce unnecessary sample preparation. We also compare suspect components with known-good samples to identify differences in internal construction, assembly, or material distribution. These insights help engineering teams investigate root causes, evaluate manufacturing processes, and develop corrective actions.
Our inspection findings support failure analysis by helping teams:
- Locate defects before selecting destructive testing methods
- Compare failed components with acceptable reference samples
- Focus root cause investigations on specific internal features
Contact Us
Call +1 (888) 287-5227 to discuss your project, or complete our online request form for a quote.
