The Applied Technical Services Family of Companies (ATS FoC) offers semiconductor microsection analysis to evaluate internal structures, material interfaces, and manufacturing quality of electronic components. Also called cross-sectioning, this destructive method involves preparing a sample, exposing an internal plane, and examining it under magnification. This enables engineers to assess construction, verify manufacturing processes, and identify defects affecting performance or reliability. Our laboratory uses microscopic examination to detect structural irregularities not visible through standard inspection. Our services help manufacturers address quality concerns, validate production, and make informed decisions regarding component acceptance and corrective actions by revealing internal conditions.
Which Materials and Components Can Undergo Microsection Analysis?
Microsection analysis is suitable for semiconductor devices and electronic assemblies requiring detailed internal examination. Our services support investigations across various materials, interconnections, and packaging configurations, including:
- Semiconductor packages: Integrated circuits, packaged chips, and other microelectronic components.
- Printed circuit boards: Multilayer boards, conductive traces, plated through holes, and interconnect structures.
- Solder joints and connections: Solder interfaces, component terminations, and attachment points.
- Conductive materials: Copper features, metallization layers, and other electrically conductive structures.
- Package materials: Encapsulants, substrates, dielectric materials, and interfaces between dissimilar materials.
These evaluations help manufacturers assess component construction, investigate production inconsistencies, and verify that critical features meet design requirements. Our engineers evaluate samples based on geometry, suspected defects, and investigation objectives. We tailor microsection analysis to each client’s specific components, materials, and concerns, ensuring we meet unique technical requirements throughout the assessment process.
About Our Semiconductor Microsection Analysis Services
Our microsection analysis combines precise sample preparation with detailed microscopic examination to characterize internal features and identify manufacturing deficiencies. Technicians section, mount, grind, and polish specimens to expose areas of interest while preserving key structural details.
Our laboratory examines characteristics such as:
- Layer thicknesses, plating distribution, and dimensions of conductive features.
- Solder joint geometry, bonding interfaces, and interconnection quality.
- Material separation, voids, cracks, and other structural irregularities.
- Alignment, construction consistency, and potential manufacturing deviations.
These services support quality control, process verification, supplier evaluation, and failure analysis.
How Does Cross-Sectioning Reveal Defects in Semiconductor Packages?
Cross-sectioning reveals internal interfaces and structures not visible through external inspection. Technicians evaluate the physical characteristics of layers, conductive pathways, solder connections, and package interfaces under magnification. This process identifies defects such as cracks, delamination, voids, insufficient plating, irregular layer thickness, and incomplete bonding. These issues may cause electrical discontinuities, weakened connections, or reduced reliability. In failure investigations, microsection analysis helps determine whether manufacturing irregularities contributed to the problem. Results provide essential physical evidence for root cause analysis, process improvement, and quality assurance.
Contact Us
Call +1 (888) 287-5227 or submit our online request form to connect with our team and learn how our laboratory testing services can support your component evaluation, manufacturing quality, and reliability goals.
