The Applied Technical Services Family of Companies (ATS FoC) uses X-ray photoelectron spectroscopy (XPS) to analyze the surface chemistry of semiconductors, helping to ensure thin films and coatings meet JEDEC standards and design specifications.
What Can XPS Analysis Identify in Semiconductors?
- Material composition
- Surface contamination and manufacturing residues
- Corrosion and chemical degradation
- Thin-film and coating integrity
- Metallization condition
- Oxidation states and oxide growth
- Interface chemistry between material layers
- Moisture-related degradation
- Root causes of surface-related reliability failures
How Our Engineers Perform XPS Analysis on Semiconductor Devices
Our engineers perform XPS analysis to measure surface elemental composition and chemical states. For semiconductor devices, wafers, or components, the process typically includes:
- Preparing the sample and loading it into the XPS vacuum chamber for accurate electron measurement.
- Exposing the sample to X-rays and performing a broad survey scan to identify surface elements and their concentrations.
- Collecting high-resolution spectra of key elements to assess chemical bonding, oxidation states, and material purity.
- Examining data for unwanted elements, residues, corrosion products, oxides, or other contaminants that may affect performance or reliability.
- Using the results to verify thin-film composition, coating integrity, oxide growth, and interfacial chemistry between layers.
- For multilayer devices, we use ion sputtering to remove layers and repeat XPS measurements to create a chemical profile across the structure.
- Comparing measured surface chemistry with design specifications or failure evidence to identify contamination, oxidation, corrosion, moisture, or manufacturing defects.
Contact Us
To schedule XPS analysis with ATS, please complete a web request form or call us today at +1 (888) 287-5227.

